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Underfill
In flip chip applications, the material injected under the die after testing to ensure reliability. This material is particularly important for flip chips mounted on substrates with different CTEs than silicon, such as FR-4 and some ceramics.
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Dictionary of Electronics Terminology INDEX:List of Terms: Terms beginning with "A", Page 1 |
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Page Number:
1 A: Page 1 of 1. |
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