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Peel Strength
A true test of the adhesion between the lead and the bonding pad after it has been soldered. This parameter is determined by peeling the component lead off the bonding pad using special fixturing on a pull tester.
See also: Hydrophilic Solvent , Diffusion , Tape Ball Grid Array (TBGA) , Spherically Compliant Suspension , Nonpolar |
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Dictionary of Electronics Terminology INDEX:List of Terms: Terms beginning with "A", Page 1 |
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Page Number:
1 A: Page 1 of 1. |
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