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-› Bump
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| Definition Of: | ||
Bump
A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.
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Dictionary of Electronics Terminology INDEX:List of Terms: Terms beginning with "A", Page 1 |
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Page Number:
1 A: Page 1 of 1. |
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