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Technology Categories
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Built-in Lead Stress
The force within leads of a molded carrier ring or TAB component that result in lead skew or splay after the excising process. Possible causes include the dam bar removal process, the stamping process used to produce lead frames, or stress induced during prior thermal or mechanical processing of the components.
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Dictionary of Electronics Terminology INDEX:
List of Terms: Terms beginning with "A", Page 1 |
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Page Number:
1 A: Page 1 of 1.
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