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Technology Categories
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C-4 (Controlled Collapse Chip Connection)
A solder joint connecting a substrate directly to an IC in a flip chip configuration. In this packaging scheme, a solder ball is formed on the IC, the IC is placed active circuitry down onto a substrate, and the solder is reflowed. As the solder melts, the solder balls collapse into a shape controlled by the surface tension of the liquid solder while supporting the weight of the IC.
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Miscellaneous INDEX:
List of Terms: Terms beginning with "A", Page 1 |
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Page Number:
1 A: Page 1 of 1.
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